Dynatron K1: LGA1155, LGA1156 Intel Core and Xeon Passive 1U Heatsink 2.5 SATA HDD 0 Amp Case Dimensions 437mm
Description
0 Amp Case Dimensions 437mm x 249mm x 43mm
At Duty Cycle 50%: 1
5" (in inches) Case Cooling 4 x 40x56mm PWM Fans Mounting Standard 19" 1U Rackmount
313 - 854MHz
Toshiba 4TB 3
Dynatron K1: LGA1155, LGA1156 Intel Core and Xeon Passive 1U Heatsink 2.5 SATA HDD 0 Amp Case Dimensions 437mmDynatron K1: LGA1155, LGA1156 Intel Core and Xeon Passive 1U Heatsink Compatibility Intel LGA1155, LGA1156 Intel Core i3 i5 i7 CPU Intel Xeon CPU Max TDP 95W Dimensions 95. 0 x 95. 0 x 26. 5mm (1U compliant) Heatsink Material: Aluminum Pre printed thermal compound: GE Toshiba TIG830SP Other RoHS Compliant
Exchange/Return Notes
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