Bostik Thermogrip H1714 Hot Melt Adhesive Brand|Melt Pro This kit includes the essential

This kit includes the essential tools needed to complete repairs efficiently

To replace applicator handles

large-volume adhesive application

and alarm applications

Brochures and User Guides

Bostik Thermogrip H1714 Hot Melt Adhesive Brand|Melt Pro This kit includes the essentialBostik Thermogrip H1714 Overview H1714 is a low application temperature hot melt adhesive for case forming and sealing applications. H1714 is a product specifically designed to provide very low application temperatures (250F to 275F) while still providing fiber tearing bonds over a wide temperature range on a variety of substrates. Key Features Low application temperature Clean running Fiber tearing bonds on a variety of board stocks